XC2V4000-4FF1152C

Product Summary

The XC2V4000-4FF1152C is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The XC2V4000-4FF1152C delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15μm / 0.12μm CMOS 8-layer metal process and the XC2V4000-4FF1152C architecture is optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the XC2V4000-4FF1152C enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays.

Parametrics

XC2V4000-4FF1152C absolute maximum ratings: (1)Internal supply voltage relative to GND: –0.5 to 1.65 V; (2)Auxiliary supply voltage relative to GND: –0.5 to 4.0 V; (3)Output drivers supply voltage relative to GND: –0.5 to 4.0 V; (4)Key memory battery backup supply: –0.5 to 4.0 V; (5)Input reference voltage: –0.5 to VCCO + 0.5 V; (6)Input voltage relative to GND (user and dedicated I/Os): –0.5 to VCCO + 0.5 V; (7)Voltage applied to 3-state output (user and dedicated I/Os): –0.5 to 4.0 V; (8)Maximum soldering temp.: +220 ℃; (9)Operating junction temperature (2): +125 ℃.

Features

XC2V4000-4FF1152C features: (1)Industry First Platform FPGA Solution; (2)IP-Immersion Architecture; (3)SelectRAM Memory Hierarchy; (4)High-Performance Interfaces to External Memory; (5)Flexible Logic Resources; (6)High-Performance Clock Management Circuitry; (7)Active Interconnect Technology; (8)SelectIO-Ultra Technology; (9)Supported by Xilinx Foundation and Alliance Series Development Systems; (10)SRAM-Based In-System Configuration; (11)0.15 μm 8-Layer Metal Process with 0.12 μm High-Speed Transistors; (12)1.5V (VCCINT) Core Power Supply, Dedicated 3.3V VCCAUX Auxiliary and VCCO I/O Power Supplies; (13)IEEE 1149.1 Compatible Boundary-Scan Logic Support; (14)Flip-Chip and Wire-Bond Ball Grid Array (BGA) Packages in Three Standard Fine Pitches (0.80 mm, 1.00 mm, and 1.27 mm); (15)Wire-Bond BGA Devices Available in Pb-Free Packaging; (16)100% Factory Tested.

Diagrams